Description
The Senior Engineer, RF Design role is responsible for supporting the development of next generation Si-Photonic Data Communications solutions in Skorpios’ Sub System engineering team. The Senior Engineer, RF Design will engage in simulation, data analysis, and product development of Module and/or Co-Packaged HPIC based products.
- Design, Model and simulate MicroStrip / Stripline Transmission lines up 120Ghz
- Model and simulate resistance and Capacitance effects from EAM and MZM Modulators, Photodiodes and Laser Diodes to provide improved RF performance of the components into integrated circuits
- Perform impedance matching over large frequency range
- Establish Netlists and perform DRC for Designs and Layouts
- Direct HPIC Layout and PCB Layout of designed components
- RF device testing and electrical/optical s-parameter measurement and characterization
- DOE Design and Design Validation Testing
- Design Review Support and Presentation
- Design for Manufacturability (DFM).
- Establish schematics designs for PCBA
- Using computer software to design RF components
Competencies
- Ability to work in an integrated and diverse team environment.
- Ability to work with a large body of data and the necessary statistical analysis tools, and the ability to present the data and ideas to a diverse audience.
- Good communication skills. Ability to present complex problems to internal peers as well as potential customers
- RF design circuitry skills
- Problem solving and trouble shooting skills
- Proficiency with Microsoft Excel
- Proficiency with HFSS and ADS Software Design Tools
- Interpersonal, verbal and written communication skills
Requirements
- 10+ years' experience
- MS or Ph.D in Electrical Engineering, Photonics or a related discipline with emphasis in optical communications and high-speed optical components.
- TIA and modulator driver understanding a must.
- Experience with RF design, simulation, and use of optical and electrical modeling tools such as HFSS, ADS to design electro-optical devices, ceramic and organic substrates.
- Experience with RF design, simulation of 50Ghz+ transmission lines on ceramic or organic substrates with wire bond and/or Flip Chip Bumping.
- Experience Converting Paper Designs into Layout and components either with customer owned tooling, or 3rd Party contractors.
- Experience with RF device testing, electrical/optical s-parameter measurements, familiarity with optical components testing methodology including equipment setup, algorithms and sensitivity analysis.
- Strong background with semiconductor optical devices such as laser, detectors, modulators and other integrated waveguide devices along with a working level understanding of associated electronic circuitry.
- Experience meeting development schedules, preparing design reviews, and communicating complex solutions to a multi-disciplinary team.
Preferred Education and Experience
- Desired are candidates with significant industrial experience in the optical components industry.
- JMP or Mini-Tab experience preferred
Work Authorization/Security Clearance Requirements
Authorization may be required to release covered technology to employees who are not U.S. citizens, U.S. nationals, lawful permanent residents, asylees, or refugees.