Job Summary 

The Hardware System Engineer is responsible for system-level hardware architecture, design, and bring-up of IoT module–based solutions on ARM/RISC-V SoC platforms. Reporting to the Hardware Department Manager, this role provides technical leadership across digital interface integration, power architecture, and end-to-end system definition, ensuring robust, scalable, and production-ready hardware solutions. 

The position requires deep hands-on expertise across the full product lifecycle, from schematic and PCB design through system debug, validation, certification support, and manufacturing ramp, while working closely with cross-functional global teams (HW, SW, RF, validation, manufacturing, and suppliers) to deliver high-quality products aligned with business and technology roadmaps. 

  Objectives & Responsibilities 

• Design and integrate M2M module–based hardware platforms covering interfaces, power, and system      architecture. 
• Develop schematics and high-density      PCBs, ensuring SI/PI and ESD/EMI/EMC compliance. 
• Perform hardware bring-up,  debugging, and validation, supporting EVT/DVT/PVT and production ramp-up. 
• Drive system validation and  reliability readiness, supporting design verification, compliance testing,      and failure analysis, and ensuring smooth transition from development to manufacturing ramp-up and mass production.
• Define and maintain clear, high-quality hardware system documentation, including architecture specifications, design guidelines, schematics reviews, and bring-up/debug records, supporting long-term maintainability and knowledge reuse across the hardware organization. 

Requirements & Qualifications

Education & Experience

• Bachelor’s degree or above in Electrical Engineering, Electronics, Communication Engineering, or related fields.
• 10 years of hands-on experience in hardware design for M2M modules, embedded systems, wireless/IoT products, or related communication devices.

Core Hardware Interface Experience (Including but not limited to)

• High-speed digital interface integration, including USB 2.0/3.x, PCIe Gen2/Gen3 (where applicable), SIM/USIM/eSIM, and GPIO, as well as related control, debug, and firmware upgrade use cases.
• Familiarity with high-speed and multimedia interfaces (e.g., MIPI-DSI/CSI, I2S/PCM), with solid signal-integrity awareness for high-speed differential links.
• Strong knowledge of ARM-based system architecture and serial/high-speed interface design rules (e.g., UART, SPI), including timing and protocol constraints.
• Experience with common peripheral and storage interfaces, including I²C/SPI-based peripherals (sensors, PMICs, EEPROM), Ethernet (RMII/RGMII is a plus), and eMMC/SD/TF, as applicable.
• Memory subsystem design and validation experience (DDR, LPDDR, NAND), including bring-up, stress testing, and issue debugging.
• Power architecture and sequencing design expertise, covering VBAT and multi-rail systems, LDOs, buck/boost converters, and key control signals (PWRKEY, RESET, BOOT, watchdog).
• Low power design experience, including sleep/wake up management and power optimization awareness.
• Schematic capture and high density PCB design/layout experience, including impedance control and differential routing; hands on exposure to SI/PI analysis and ESD/EMI/EMC protection.
• Strong bring up, debug, and failure analysis skills, with experience supporting EVT/DVT/PVT and production ramp up using common measurement tools (oscilloscope, logic analyzer, protocol analyzer).
• Clear documentation and cross functional collaboration skills, with the ability to produce structured design and test documentation (schematics, BOMs, design notes, reports) and work closely with RF, software, test, manufacturing, and system teams.

 Preferred Qualifications 

•  Hands-on experience with wireless module platforms and modem/baseband chipsets; solid understanding of 3GPP fundamentals is a plus. 
• Experience with thermal design considerations, including component-level and system-level thermal evaluation and mitigation. 
• Experience collaborating with ODM/JDM partners and supporting NPI ramp-up and mass production is a plus.
• Experience with cellular/Wi-Fi/BT connectivity products and module integration is highly preferred.
• Proficiency in English (written and spoken) to collaborate effectively in global, cross-functional teams.